Professional-grade double-coated polyester tape with natural rubber adhesive for semiconductor CMP applications, offering clean removal and reliable bonding strength
3M™ Double Coated Polyester Tape 442KW is a premium double-sided bonding tape specifically engineered for semiconductor chemical mechanical planarization (CMP) applications. This high-performance tape features a natural rubber-based adhesive system (3M™ Adhesive 830) that provides fast, reliable bonding strength while ensuring clean removal from platens and pads. The thin polyester (PET) film carrier laminate allows the adhesive to bond firmly to both polishing pads and platens, making it ideal for precision semiconductor manufacturing environments.
The tape comes with a polycoated paper release liner that provides excellent dimensional stability and ensures fast and efficient conversion during application. With a total thickness of 4 mil (0.102 mm) without the liner and an overall width of 4 inches (101.6 mm), this roll offers 10 yards (9.144 m) of continuous bonding surface. The adhesive has been specifically chosen for semiconductor CMP applications due to its superior adhesion properties, temperature performance, and solvent resistance, making it compatible with a wide variety of substrates including fabric, film, foil, and paper.
Beyond semiconductor manufacturing, this versatile double-coated tape is also applicable for polishing pad attachment to platens in HDD (hard disk drive) and glass manufacturing applications. The rubber-based adhesive ensures reliable performance within the operating temperature range of 50°F to 100°F (10°C to 38°C), providing consistent bonding strength and clean removal characteristics. With an 18-month shelf life and available as a single roll per case, this professional-grade tape delivers the precision and reliability required for critical manufacturing processes.
Key Features
- Double-sided natural rubber adhesive for superior bonding strength and clean removal
- Thin polyester film carrier ensures firm adhesion to polishing pads and platens
- Specifically formulated for semiconductor CMP applications with 3M Adhesive 830
- Polycoated paper release liner provides excellent dimensional stability
- Compatible with multiple substrates including fabric, film, foil, and paper
- Operating temperature range from 50°F to 100°F (10°C to 38°C)
- High shear strength and solvent resistance for reliable performance
- Clean removal characteristics ideal for precision manufacturing
Technical Specifications
| Specification |
Value |
| Product Number | 442KW |
| Overall Width | 4 inches (101.6 mm) |
| Overall Length | 10 yards (9.144 m) |
| Total Tape Thickness without Liner | 4 mil (0.102 mm) |
| Overall Thickness | 12.5 mil (0.318 mm) |
| Backing Material | Polyester (PET) Film |
| Backing Thickness | 1 mil (0.025 mm) |
| Face Side Adhesive Thickness | 1.5 mil (0.038 mm) |
| Back Side Adhesive Thickness | 1.5 mil (0.038 mm) |
| Adhesive Type | Natural Rubber (3M Adhesive 830) |
| Number of Adhesive Sides | Single-sided (double-coated application) |
| Primary Liner Material | Polycoated Bleached Kraft Paper |
| Primary Liner Color | White |
| Primary Liner Thickness | 5.6 mil (0.142 mm) |
| Minimum Operating Temperature | 50°F (10°C) |
| Maximum Operating Temperature | 100°F (38°C) |
| Clean Removal | Yes |
| UV Resistant | No |
| Indoor/Outdoor | Indoor |
| Shelf Life | 18 Months |
| Product Form | Roll |
| Units per Case | 1.0 |
| Substrate Compatibility | Fabric, Film, Foil, Paper |
| Primary Application | CMP Pads, Platens, Polishing Pads |
| Brand | 3M |
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